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Course Catalog 2014-2015
ELT-22236 Electronics Miniaturisation, 5 cr |
Additional information
Suitable for postgraduate studies
Will not be lectured year 2014-2015
Person responsible
Matti Mäntysalo
Requirements
Passed final examination and seminar work
Completion parts must belong to the same implementation
Learning Outcomes
After completing the course, the student knows the most common electronic miniturization and packaging technologies. He is familiar with different integration approaches, and can compare qualities and benefits of different techniques and approaches. Student knows the driving forces behind miniaturization.
Content
| Content | Core content | Complementary knowledge | Specialist knowledge |
| 1. | Miniturization approaches of entire system (SoP vs SoC). | Driving forces of miniturization. Application field. | Reading ITRS roadmap for microelectronic packaging |
| 2. | Microelectronic packaging technologies used in miniaturization (CSP, Wafer level, TSV) | Microelectromechanical system (MEMS) and optoelectronic packaging | |
| 3. | Integration of passive components (integration to chip, integration to PWB, passive arrays). | Passive component materials and fabrication techologies | Restriction of the use passive components set by fabrication technologies |
| 4. | Multilayer wiring, substrate technologies, microvias |
Instructions for students on how to achieve the learning outcomes
Grade 1-2: Learning outcomes have been achieved. Satisfactory knowledge of the core contents. Grade 3-4: Some of the learning outcomes have been exceeded either qualitatively or quantitatively. Good knowledge of the core contents and complementary knowledge. All partial completions of the course have completed (at least good). Grade 5: Most of the learning outcomes have been exceeded qualitatively. Profound knowledge of the entire course contents. All partial completions have been completed excellently.
Assessment scale:
Numerical evaluation scale (1-5) will be used on the course
Partial passing:
Study material
| Type | Name | Author | ISBN | URL | Edition, availability, ... | Examination material | Language |
| Book | Introduction to System-on-Package (SOP): Miniaturization of the Entire System | Rao R. Tummala | 0071603158 | Löytyy e-kirjana TTY:n kirjaston kautta | Yes | English | |
| Lecture slides | lecture notes | Shared via Moodle | Yes | English | |||
| Other literature | Kurssin seminaarityöt | Kurssilla on seminaariesitelmiä | Yes | English | |||
| Other literature | Scientific articles | links are shared via Moodle | Yes | English |
Prerequisite relations (Requires logging in to POP)
Correspondence of content
| Course | Corresponds course | Description |
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